Rugged Mini E3 V2

$950.00

CPU*

Memory*

Samsung 2 X 260-pin DDR4 SO-DIMM

Memory*

Samsung 2 X 260-pin DDR4 SO-DIMM

Storage

Hospital Features

Total: $950.00
Category:

Key Features

  • Fanless | Optional TPM
  • Wide Temp Operation

Applications

Manufacturing | Automation

SPECIFICATIONS

System
Processor Intel Pentium Gold G6400T, 2-core, 3.4GHz
Intel Core i5-10500T, 6-core, 2.3GHz (up to 3.8GHz)
Intel Core i7-10700T, 8-core, 2.0GHz (up to 4.5GHz)
System Chipset Intel H470 (Comet Lake)
Graphics Controller Intel UHD Graphics 610 (Pentium CPU)
Intel UHD Graphics 630 (Core CPU)
LAN Chipset 1 x GbE: Intel i219-LM
1 x GbE: Intel i211
System Memory Up to 64GB DDR4 2666 (2 x SO-DIMM)
BIOS Insyde 64Mbit
TPM Intel PTT (fTPM 2.0) Standard
vPro Optional: vPro with Infineon TPM 2.0 (dTPM)
Storage
NVMe 2 x M.2 2280 “M” Key (PCIe x 4) – Support up to 4TB NVMe
RAID Support RAID 0, 1
Expansion
M.2 1 x M.2 2230 “E” Key PCIe x 1 (WiFi)
Other
Cooling Method Fanless
I/O
Video 2 x HDMI
1 x DP (Display Port)
COM 4 x D89 Serial RS232
USB 2 x USB 3.0 (Front)
2 x USB 3.0 (Rear)
LAN 2 x GbE RJ45
WLAN Optional: Intel WiFi 6 Ax200 + BT 5.2LE w/dual Antennas
Audio 1 x Line-out
Others 1 x Power Switch
Operating System
Windows Windows 10 Pro 64bit
Windows 11 Pro 64bit
Windows 10 IoT Enterprise SAC or LTSC
Linux Ubuntu
Power
Power Mode AT/ATX
Power Input Voltage 15 ~ 20VDC
Power Connector Barrel Connector 4.7×1.7mm
Power Adapter External Power Adapter, 19V @ 6.31A
Environment
Operating Temp. -14°F to 122°F (-10°C to 50°C)
Storage Temp. -4°F to 140°F (-20°C to 60°C)
Relative Humidity 0% – 90% non-condensing
Certification ANSI/AAMI ES60601-1, IEC60601-1-2, FCC Part 18, FCC Part 15 Class B, CE
Physical
Enclosure Materials Aluminum alloy, antimicrobial enclosure
Dimension (WxHxD) 8.0″ x 1.7″ x 9.1″ (202mm x 43.5mm x 232mm)
Weight 4.7 lbs. (2.1 kg)
Mounting Optional: Self-Standing Base
Optional: 75mm & 100mm VESA Mount Bracket
Warranty
Warranty 1-Year Standard

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